Solutions
Examples of All Solutions
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High-voltage (10,000V) insulation test socket.
The high-voltage test socket supports up to 10,000V and features developed large-stroke press and probe pins. We also offer a variety of contacts for different currents and can provide custom solutions.
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IGBT Test Socket
Stable contact performance (1000A) with high current terminals for AC/DC testing. Reduced contact marks and high durability with press contacts for insulation testing.
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High-Frequency Socket for System-Level Testing
Enhanced Grounding and Excellent High-Frequency Characteristics Achieved by Plating the Housing
Supports PAM4 Serdes 112Gbps Operation -
High Pin Count Solutions
Achieves stable contact performance and long life.
High current capacity is possible with integrated springs. -
Spring Kelvin Contact
Achieves stable contact performance and long life.
High current capacity is possible with integrated springs. -
QFP/SOP Open Top Socket with Ground Pins
Stable Contact Performance with Cantilever Structure (2-Point Contact)
Ground Pins for Continuity Testing and Heat Dissipation Pins for High-Heat Packages -
Spring Probe Pin
Enplas's own design will provide internal short circuit of probe pin with low resistance value (Ave 50m ohm or under)
Enplas provides suitable socket design proposal to meet required specification -
Curling Contact Series
Cost saving solution with the same performance as probe pin
Long stroke pin which works for device warpage in accordance with recent large size device -
Low Contact Force Pin
High pin count socket can be used for existing equipment
Yield improvement in test of sensor device -
Chip Contactor
Huge cost reduction of chip contactor which supports high current with tooled contact pin and contact module
Moduled contact pin related component makes it easier to exchange the parts on site. -
Non-magnetic Socket
Non-magnetic socket will be required for sensor application
Corrosion resistance with non-magnetic performance -
Open top BGA two contact socket
Stable contact performance due to (two-point contact) structure
Double door structure makes it easy to insert PKG -
Open Top QFP/SOP pinch type socket
Pinch type contact (2-point contact) makes stable contact
Contact pin surface cleaning function prevents from accumulating debris due to the step between the bottom pin and the molded body surface. -
Custom socket for high power liquid cooling system
Not only BGA, and LGA, but also various type of package including QFN can be designed by using a socket that is suitable for the thermal head size
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LCF series (general-purpose molded frame)
Low price and quick delivery for various devices up to 100mmx100mm
Replacible on site by surface mounting method -
Carrier Socekt
Easy package handling with carrier PCB
Multi-height pusher for different thickness devices -
Sockets for power devices
Compatible with various power devices that are not handled by other companies
It is also possible to consider the optimum pin arrangement and support large currents of power devices. -
Open Top Socket with Cover
Open top socket integrated with a mechanism that protects the entire top surface of the PKG.
Socket with cover to prevent dust in the air from coming into the socket. -
Improved cover handling socket for large devices
Enable to operate with stable pressing force for high pin count solutions.
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Height adjustable socket
By just switching a lever, the height of Heat sink pressing surface is adjusted to enable one IC socket to test PKGs of different thickness.
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Socket with heat sink
Heat Sink will reduce the increase of device temperature by contacting device surface with this parts and radiating the device heat into the air.
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Burn-in socket with heat pipe
High heat dissipation performance due to the heat circulation structure of the heat pipe improves the accuracy of individual temperature adjustment tests for high heat generation PKG.
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Test socket with heat pipe
The high heat dissipation capacity enabled by the heat pipe's thermal circulation structure allows for the measurement of devices with high-heat-emitting packages.
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Individual Temparature Control System
Heater and temperature sensors can be attached to control the temperature of the device for each socket.
Achieves more accurate temperature control in comparison with general burn-in equipment (temperature setting ± 3 ° C) -
Conductivity Carbon Coating
Achieved a significant longer life of contacts by preventing solder migration
Achieved high durability with high slidablity and hardness -
High pin count BGA socket (VC contact)
Stamped contact pin and molded frame realize significant cost reduction for large PKG
Replacible on site by surface mounting method -
Super Shrink Socket
Increase of BIB density (1.8 times better density rate per 1 BIB)
In the condition of same socket qty, the reduction of BIB qty (45% reduction) -
Capsule contact
The short-length probe pin structure (total length 1.5 mm) realizes good high-frequency characteristics.
Ideal for high-speed transmission and low-voltage products -
Coaxial Contact Pin
Coaxial structure is the most suitable solution for high frequency characteristics requirement.
Minimizes crosstalk performance with shielded metal housing. -
ES Plating
By developing special plating (ES plating), the life of burn-in socket contacts has been extended in high temperature environments.
Maintenance costs have also been significantly reduced by reducing re-gold plating costs, etc. -
AM contact series
Low price and quick delivery for various devices by using machined Contact unit
Replacible on site by surface mounting method