Solutions
Examples of Cost Solutions
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Spring Probe Pin
Enplas's own design will provide internal short circuit of probe pin with low resistance value (Ave 50m ohm or under)
Enplas provides suitable socket design proposal to meet required specification -
Curling Contact Series
Cost saving solution with the same performance as probe pin
Long stroke pin which works for device warpage in accordance with recent large size device -
Low Contact Force Pin
High pin count socket can be used for existing equipment
Yield improvement in test of sensor device -
Chip Contactor
Huge cost reduction of chip contactor which supports high current with tooled contact pin and contact module
Moduled contact pin related component makes it easier to exchange the parts on site. -
Open top BGA two contact socket
Stable contact performance due to (two-point contact) structure
Double door structure makes it easy to insert PKG -
LCF series (general-purpose molded frame)
Low price and quick delivery for various devices up to 100mmx100mm
Replacible on site by surface mounting method -
Height adjustable socket
By just switching a lever, the height of Heat sink pressing surface is adjusted to enable one IC socket to test PKGs of different thickness.
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High pin count BGA socket (VC contact)
Stamped contact pin and molded frame realize significant cost reduction for large PKG
Replacible on site by surface mounting method -
Super Shrink Socket
Increase of BIB density (1.8 times better density rate per 1 BIB)
In the condition of same socket qty, the reduction of BIB qty (45% reduction) -
AM contact series
Low price and quick delivery for various devices by using machined Contact unit
Replacible on site by surface mounting method