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This socket, with its heat dissipation capabilities enabled by a heat pipe, supports devices with high heat output up to 1000W.

We select the optimal socket frame based on your package’s external dimensions and cooling requirements, and offer customized designs combining heat sinks and heat pipes.

The heat pipe efficiently dissipates heat from the package by circulating water vapor that evaporates when heated, moving through a capillary structure where it is cooled.

Thanks to these features, the socket can effectively dissipate heat, enabling testing of devices with high heat output.

*Heat sink: A type of cooling component that transfers heat from semiconductor elements or heat-generating components to the body of the heat sink, where it exchanges heat with the air to cool down.

*Heat pipe: A system where a cooling liquid sealed within a hollow metal pipe vaporizes and liquefies repeatedly due to heat, facilitating thermal transfer.