Solutions
Custom socket for high power liquid cooling system
- Not only BGA, and LGA, but also various type of package including QFNcan be designed by using a socket that is suitable for the thermal head size
- Not only BGA, and LGA, but also various type of package including QFN can be designed by using a socket that is suitable for the thermal head size
This socket is compatible with high power solutions that requires liquid cooling system. This socket is versatile that could be used with the combination of AM, Curling pin. For the QFN devoices, AM contact pin can be used, and Curling pin can be used for BGA / LGA devices while maintaining the low cost / short lead-time.
This product is recommended for those who are looking for a socket for liquid cooling systems.
Examples of IC Socket Solutions Solution Examples
- All Solutions
- Choose by application
- Choose by device
- Choose by PKG
- Choose by issue
Examples of CPU/GPU Solutions
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Spring Probe Pin
Enplas's own design will provide internal short circuit of probe pin with low resistance value (Ave 50m ohm or under)
Enplas provides suitable socket design proposal to meet required specification -
Curling Contact Series
Cost saving solution with the same performance as probe pin
Long stroke pin which works for device warpage in accordance with recent large size device -
Low Contact Force Pin
High pin count socket can be used for existing equipment
Yield improvement in test of sensor device -
Custom socket for high power liquid cooling system
Not only BGA, and LGA, but also various type of package including QFN can be designed by using a socket that is suitable for the thermal head size
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LCF series (general-purpose molded frame)
Low price and quick delivery for various devices up to 100mmx100mm
Replacible on site by surface mounting method -
Improved cover handling socket for large devices
Enable to operate with stable pressing force for high pin count solutions.
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Height adjustable socket
By just switching a lever, the height of Heat sink pressing surface is adjusted to enable one IC socket to test PKGs of different thickness.
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Socket with heat sink
Heat Sink will reduce the increase of device temperature by contacting device surface with this parts and radiating the device heat into the air.
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Burn-in socket with heat pipe
High heat dissipation performance due to the heat circulation structure of the heat pipe improves the accuracy of individual temperature adjustment tests for high heat generation PKG.
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Test socket with heat pipe
The high heat dissipation capacity enabled by the heat pipe's thermal circulation structure allows for the measurement of devices with high-heat-emitting packages.
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Individual Temparature Control System
Heater and temperature sensors can be attached to control the temperature of the device for each socket.
Achieves more accurate temperature control in comparison with general burn-in equipment (temperature setting ± 3 ° C) -
Conductivity Carbon Coating
Achieved a significant longer life of contacts by preventing solder migration
Achieved high durability with high slidablity and hardness -
High pin count BGA socket (VC contact)
Stamped contact pin and molded frame realize significant cost reduction for large PKG
Replacible on site by surface mounting method -
Capsule contact
The short-length probe pin structure (total length 1.5 mm) realizes good high-frequency characteristics.
Ideal for high-speed transmission and low-voltage products -
Coaxial Contact Pin
Coaxial structure is the most suitable solution for high frequency characteristics requirement.
Minimizes crosstalk performance with shielded metal housing. -
ES Plating
By developing special plating (ES plating), the life of burn-in socket contacts has been extended in high temperature environments.
Maintenance costs have also been significantly reduced by reducing re-gold plating costs, etc. -
AM contact series
Low price and quick delivery for various devices by using machined Contact unit
Replacible on site by surface mounting method