Using burn-in and test sockets to address issues in product assessment,
electrical properties, and reliability testing of various devices.

Solutions

LCF series (general-purpose molded frame)

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  • Low price and quick delivery for various devices up to 100mmx100mm
  • Replacible on site by surface mounting method
  • Applicable to a wide range of PKG type such as BGA or QFN by stamping and machining technology

Various molded parts are available so that the optimum size can be selected at a low price without incurring initial costs. These molded frames are designed with a heat sink optimized by thermal simulation for high power PKGs and a pressure plate designed to push down the optimum point of PKG with bare die or particular shape. Such custom design is available up to 100 mm square PKG. In addition, by making full use of the wide contact pin lineup and FR4 machining technology, a wide variety of PKGs can be supported regardless of small Q’ty. (minimum pitch: 0.25 mm)

Available contact units are AM contact, Curling contact, and VC contacts series.

Generally, IC socket’s through hole pins are soldered on board, but this LCF series use surface mounting method. Since IC socket is just fixed on board with screws, IC socket can be replaced easily. In addition, we can propose the optimum heat sink shape by 3D simulation technology according to the test environment.

PKG outline: MAX □ 100 mm

Pitch: 0.25mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm, 1.0mm, 1.27mm

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