Using burn-in and test sockets to address issues in product assessment,
electrical properties, and reliability testing of various devices.

QFN socket

qfp_bi

The burn-in QFN socket contacts the QFN terminal with a contact to provide an electrical connection. There are two types of contacts: a type that two contact the lead and a probe pin type that pierces the lead. For the open top socket, we provide a design that emphasizes contactability by a sandwiching structure (two-point contact), a cleaning function for the contact pin contact surface, and a solution that reduces solder debris such as prevention of impurity accumulation due to the step between the bottom pin and the resin surface. I have.

Enplas Semiconductor Equipment Co., Ltd., which operates IC Socket Solution.com, also provides heat dissipation solutions for heat-generating PKG.

Points

For burn-in QFN sockets, it is necessary to select the optimum specifications depending on the usage method, usage environment, and important functions. Here, we will introduce the important points in determining the specifications of the QFN socket for burn-in.

Point#1

Select either open top or clamshell from the method of setting the device

Select the open top type when moving the device in and out by machine, and the clamshell type when inserting and removing it by hand.

Point#2

Select the mounting method on the board by either focusing on contact reliability or focusing on maintainability.

Select the solder mounting method if you want to emphasize the contact reliability between the socket and the board, and select the surface pressure welding method if you want to emphasize maintainability.

 

※Precautions

Solder mounting method: Emphasis on contact reliability It is a pin that makes contact with one contact point, and the pad is relatively large and the terminal pitch is 0.4 mm or more. In addition, QFN sockets are relatively inexpensive because they are mainly made of molded products.

Surface pressure welding method: Emphasis on maintainability The contactor of the QFN socket is a lower contact probe pin. Since the pin of this bottom contact probe pin can move vertically, it is resistant to deformation (warp) of PKG, and it is possible to support narrow pitch and multi-pitch by supporting some cut products. It can also support QFN with a terminal pitch of 0.4 mm or less.

Point#3

Consider methods for heat dissipation and large current depending on the characteristics of PKG

As a measure to prevent thermal runaway due to heat generation of PKG, consider a heat sink after performing heat generation simulation. If it is compatible with large currents, consider using a bypass pin.

Point#4

Select general-purpose socket or custom socket depending on the PAD arrangement of PKG

For standard PAD arrangements, choose from an inexpensive standard lineup, and for fine pitch / multi pitch, choose a custom socket that suits it.

Point#5

Select the best contactor by PAD material and PKG bottom

Our technical staff will select the optimum pin plating material and shape according to the PAD material, the height of the PAD surface with respect to the bottom of the PKG, and the PAD outer shape.

Issues

Since the QFN socket for burn-in needs to exhibit stable performance even in a harsh environment, it is necessary to incorporate measures to avoid troubles in advance by utilizing simulation technology. Here are some common problems you may have when using QFN sockets for burn-in and solutions to them.

Issues #1

Thermal runaway due to PKG's self-heating

Devices with high self-heating of PKG may cause thermal runaway during burn-in tests in high temperature environments. If this happens, you will not be able to perform a burn-in test.

Solutions

Utilize thermal analysis simulation and avoid it by installing the optimum heat sink!

Issues #2

I want to use up to the high frequency band even in burn-in

Devices that use QFN sockets may be required to support high frequencies even at burn-in. However, since the characteristics of normal contact pins do not correspond to the high frequency band, it is necessary to adopt contact pins that meet the required specifications.

Solutions

The solution is to use a low inductance pin specification (0.7nH @ 500MHz / GSG 0.35mm pitch)!

Issues #3

Repeated burn-in reduces device yield

For Au-plated contact pins, the base of the contact pin may be exposed as the burn-in process is repeated. If this happens, the tin plating on the PKG lead will be transferred and peeled off, and the contact between the socket (contact pin) and the device will be poor. As a result, the burn-in test will be NG and the yield with the device will decrease.

Solutions

Achieves a long life with contact pins that use ES plating!

Examples of Solutions for
QFN socket

Solutions

IC Socket Solutions.com offers IC socket solutions that apply a wealth of experience and simulation technology to all the challenges that arise when burn-in testing QFN.

Lineup

Pitch3mm□4mm□5mm□6mm□7mm□8mm□9mm□10mm□
Through hole type0.4mm36pin40pin562in56pin68pin72pin88pin
0.5mm20pin24pin36pin40pin56pin64pin68pin
0.65mm12pin16pin24pin28pin40pin44pin52pin
PitchAM Pin10mm□18mm□23mm□35mm□
Surface mount type0.35mm~shrink#bg#
std. CS#bg##bg#
Type SS#bg##bg##bg#
Type S#bg##bg##bg##bg#
Pitch5mm□6mm□7mm□8mm□9mm□10mm□
Through hole type0.4mm40pin64pin
0.5mm32pin36pin
40pin
48pin56pin64pin68pin
0.65mm28pin32pin48pin
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Inquiries
qfp

The test QFN socket is one of the test sockets that is required to have a long life and high current. When emphasis is placed on electrical characteristics, the short-length probe pin supports high current in the Kelvin test, and the hard Pd alloy also supports the long life of contacts. Probe Kelvin contact socket, high current support If you are looking for a press kelvin contact socket that achieves stable contact and long life with surface pressure contact type press contact pins. Since the press Kelvin contact socket is a surface pressure welding method, it is easy to replace the pin when it is worn out, making it ideal for mass production test applications.

Enplas Semiconductor Equipment, which operates IC Socket Solution.com, solves all the problems of QFN sockets for final testing.

POINTS

For the QFN socket for testing, it is necessary to select the optimum specifications according to the usage method, usage environment, and important functions. Here, we will introduce the important points in determining the specifications of the QFN socket for testing.

Point1

Select the optimum pin according to the required specifications and requirements

Select contact pin specifications according to specifications and requirements, such as probe pins when electrical characteristics are important, press pins when high current and high temperature are required, and press pins when price is important. To do.

Point2

If contact stability is important, adjust the pin tip shape and stroke amount.

Since the crown shape at the tip of the pin has more protrusions, the more the protrusions are, the more advantageous the contact is. Also, select a pin that can adjust the stroke amount according to the device.

Point3

Select the material of the contact pin tip according to the required durability

In order to improve wear resistance, carbon coating is applied to the tip of the contact pin, or the material of the tip of the pin is changed to palladium alloy or SK material to improve durability against wear or prevent Sn from adhering to the contact pin. It leads to the improvement of life and contact stability.

Issues

Since the QFN socket for testing needs to exhibit stable performance even in a harsh usage environment, it is necessary to incorporate measures to avoid troubles in advance by utilizing simulation technology. Here are some common problems and solutions for using test QFN sockets.

Issues #1

I want to improve the durability of the socket

Durability is important because the test QFN socket is used repeatedly. The standard contact pin is made of beryllium copper plated with gold, but if the pin tip is used repeatedly, wear and Sn adhesion will progress, and as a result, poor contact will easily occur.

Solutions

Avoid pin wear by using palladium plating and SK material!

The carbon coating avoids deterioration of contact due to Sn plating adhesion!

Issues #2

Cannot reliably evaluate micro signal characteristics

In the electrical characteristic test, it is necessary to confirm whether it works with a minute signal in particular, but it is not possible to reliably evaluate the minute signal characteristic because the increase in resistance value cannot be suppressed with a contact pin for a normal test socket.

Solutions

Can cancel the effect of contact pins on PKG characteristics

Uses Kelvin contact pin (probe press)

Issues #3

PKG dimensional variation is large and contact is not stable

QFN packages are prone to poor contact due to unstable positioning due to large dimensional variations. These package dimensional variations need to be absorbed by increasing the contact margin in the test QFN socket.

Solutions

Increase the margin with multi-point contact solution and solve contact failure!

Issues #4

I want a test socket that can handle large currents

In the case of QPN package, there are many cases where high current support is required, such as when 10 amperes or more are applied per pin, but normal contact pins do not support this. Therefore, it is necessary to select a contact pin that supports high current.

Solutions

Press-Kelvin contact socket for high current

Achieves stable contact and long life

Examples of Solutions for
QFN socket

Solutions

IC Socket Solution.com provides IC socket solutions that apply abundant achievements and simulation technology to all the problems that occur in the final test of ICs in QFN package.

Lineup

PitchOperation TemperatureLifetimeLoadContact ResistanceCurrent
Press Kelvin0.4mm-65℃~150℃500,000 times45gf100mΩ8A
0.5mm
0.65mm
0.8mm
1.0mm
1.27mm
pitchOperation TemperatureLifetimeLoadInsertion Loss/ Reflection Loss
Capsule Pin0.5mm-55℃ ~ +125℃200,000 times25gf>20GHz at -1dB / >20GHz at -10dB
0.8mm250,000 times
Probe Pin0.8mm200,000 times
0.5mm200,000 times
0.4mm1,000,000 times
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Inquiries