Using burn-in and test sockets to address issues in product assessment,
electrical properties, and reliability testing of various devices.

Socket for Application Processor

Supported Packages

ap_bi

Application processor is considered as the brain of the smart phone, so, the device has smaller pitch and higher pin count to meet the requirement of high performance/high speed. Consequently, the socket also needs to support smaller pitch and higher pin count. Enplas provides such socket as fine-pitch socket, high pin count socket, or special type of socket for PoP package.

Burn-in socket for application processor is used under high temperature environment with the package. Therefore, the socket with heater and sensor will be used in order to control pakage temperture under various temperature environment.

Fine pitch/high pin count device for application processor generates a lot of head due to high wattage, so, socket needs to have heat readiation perforamnce. Using thermal simulation, we design heatsink or heat pipe, and propose customized socket to the customer.

Points

For BI sockets for Application Processor, it is necessary to select the optimum specifications depending on the usage, environment, and the function of device. Here are important points in determining the specifications of BI sockets for CPU / GPU

Point#1

Choose contact pin for fine pitch which is the characteristic of the socket

The package for AP will be fine pitch, so, we choose the contact pin for fine pitch (0.4mm, 0.35mm, 0.3mm).

Point#2

Choose temperature control function option or electrostatic countermeasure component option

The socket with heater/sensor which is for temperature control in high temperature test will be used. Also, we can choose ESD compliant component for antistatic requirement.

Point#3

Additional heat radiation measure option for further heat generation due to high power device

In case of high heat generation package with high wattage, customized heat sink shape/ heat pipe or heat spreader for liquid thermal control system will be used in addition to thermal control function.

Point#4

Choose suitable contact pin based on required electric characteristic

High frequency compliant cupsel contact pin for low inductance or probe pin for high current will be selected

Issues

Since BI sockets for Application Processor need to keep stable performance even in harsh environments, it is necessary to incorporate measures to avoid troubles in advance by utilizing simulation technology. Here are common problems and solutions when using sockets for BI sockets for Application Processor

Issue #1

Device high heat due to fine pitch

Application processor trend is fine pitch and high pin count for high speed and high functionality among increasing number of smartphone components. Therefore, the fine pitch device is easy to creat the heat and has the possilibty of thermal runaway during burn in test.

Solutions

Select customized design of heat sink based on thermal simulation result

Issue #2

Different thickness device test in 1 socket

For PoP package, we have the test case of one side test other than the test with upper and lower side package. For such test, usually 1 socket works for 1 type of thickness, so, if thickness is different, the customer needs to obtain multiple socket corresponednce to the thickness type.

Solutions

Height adjustmnet socket will work for different thickness device.
Efficiency of test will be up.

Issue #3

Socket cost incresed due to fine pitch or higher pin count

The cost of burn in socket for application processor becomes higher due to fine pitch and higher pin count. In addition, conventional burn in socket requires initial cost, so, new idea for cost reduction is reuiqred

Solutions

Cost reduction proposal with AM contact series socket

Examples of Solutions for
Socket for Application Processor

Supported Packages

Solutions

IC Socket Solutions.com offers IC socket solutions that apply a wealth of experience and simulation technology to all the challenges that arise when burn-in testing for AP

Contact Us

Inquiries
ap_test

Application processor is considered as the brain of the smart phone, so, the device has smaller pitch and higher pin count to meet the requirement of high performance/high speed. Consequently, the socket also needs to support smaller pitch and higher pin count. Enplas provides such socket as fine-pitch socket, high pin count socket, or special type of socket for PoP package.

The number of use time for test socket is higher than that for burn-in socket because final test is short test time. So, long life time measuer of the socket is required and we are expected to include such feature in the spec of test socket.

Points

For Test sockets for Application Processor, it is necessary to select the optimum specifications depending on the usage, environment, and the function of device. Here are important points in determining the specifications of Test sockets for Application Processor.

Point#1

PoP compatible socket will be selected for Pop PKG test

When AP is PoP PKG case, PoP compatible socket will be selected for both contact of pad on PKG and ball on lower side.

Point#2

Suitable contact pin or probe pin will be selected for fine pitch requirement

Suitable cupsle contact pin or probe pin will be selected for fine pitch requirement, such as 4mm or smaller pitch of pkg ball.

Point#3

Choose the material of contact pin tip based on required life time

In order to increase the abrasion resistance, we have several solution. Carbon coating on pin tip or change of the material on pin tip into Pd alloy or carbon tool steel material (SK material) will bring better abrasion resistance or stabe contact performance with avoiding Sn waste on pin tip.

Point#4

The most suitable pin will be selected for electric characteristics.

Cupsle contact or coaxial contact will be selected for high required spec (for example high frequency requirement)

Issues

Test socket for AP application requires the stable performance under severe condition, so, we need to prepare the measure to avoid the trouble which will be anticipated in advance. We offer the solution for the problems which are frequently asked.

Issue #1

High frequency requirement for the socket

Test socket for AP purpose require the capability of the measurement for high speed signal. Usual contact pin does not meet such requirement, so, we need to select the suitable contact pin for it

Solutions

Short length capsule contact pin will be the choice.
Also, Coaxial contact pin with impedance matching will be the solution.

Issue #2

The socket compatible with PoP type device is required

The socket compatible with PoP type device is required ?>

PoP type package requires the socket with high accuracy on the test due to the contact on upper/bottom array in the same time. Usual test socket can contact only single side.

Solutions

PoP compatilbe socket will be the choice

Examples of Solutions for
Socket for Application Processor

Supported Packages

Solutions

IC Socket Solution.com provides IC socket solution that applies abundant achievements and simulation technology to all the problems that occur when conducting the final test of AP.

Contact Us

Inquiries