Using burn-in and test sockets to address issues in product assessment,
electrical properties, and reliability testing of various devices.

SOP socket

qfp_bi

The burn-in SOP socket connects the contact pin with the SOP terminal to pass an electrical connection. There are two types of contacts: one is that a stamping pin sandwiches the lead, and another one is that probe pin pierces the lead. For the open top socket, we provide a design that enhances the pin contactability by the sandwiching structure (two-point contact), which can also reduces solder debris such as prevention of impurity accumulation due to the step between the bottom pin and the molded surface

Enplas Semiconductor Peripheral Corporation, which operates IC Socket Solution.com, also provides heat dissipation solutions for heat-generating PKG.

Points

For burn-in SOP sockets, it is necessary to select the appropriate socket specifications depending on the test method, environment, and important functions. Here, we introduce the important points in determining the specifications of the SOP socket for burn-in.

Point#1

Select either open top or clamshell from the method of setting the device

Select the open top type when moving the device in and out by machine, and the clamshell type when inserting and removing it by hand.

Point#2

Decide how to position (guide) the package

Select the mold guide method when you place importance on firm positioning and stability, such as in mass production, and the lead guide method when you want to have versatility so that you can handle changes in PKG thickness.

Point#3

Consider methods for heat dissipation and large current depending on the characteristics of PKG

As a measure to prevent thermal runaway due to heat generation of PKG, consider a heat sink after performing heat generation simulation. If it is compatible with large currents, consider using a bypass pin.

Issues

Since the SOP socket for burn-in needs to exhibit stable performance even in a harsh environment, it is necessary to incorporate measures to avoid troubles in advance by utilizing simulation technology. Here are some common problems you may have when using burn-in SOP sockets and solutions to them.

Issues #1

Thermal runaway due to PKG's self-heating

Devices with high self-heating may cause thermal runaway during burn-in tests in high temperature environments. If this happens, burn-in test cannot be completed.

Solutions

Utilize thermal analysis simulation and avoid it by installing the appropriate heat sink!

Issues #2

Repeated burn-in tests scratch PKG

Repeated burn-in tests inevitably generate solder debris, which can lead to cosmetic problem. In addition, PKG may be caught by the generated debris.

Solutions

Solve it with our unique wiping technology, already used by many customer.

Issues #3

Repeated burn-in reduces device yield

For Au-plated contact pins, the base of the contact pin may be exposed as the burn-in process is repeated. If this happens, the tin plating on the PKG lead will be transferred and peeled off, and the contact between the socket (contact pin) and the device will be poor. As a result, the burn-in test will be failed or the yield with the device will decrease.

Solutions

ES plating will bring a longer lifespan.

Examples of Solutions for
SOP socket

Solutions

Lineup

SocketPitch16pin24pin32pin44pin48pin52pin64pin68pin70pin80pin92pin100pin112pin116pin118pin120pin128pin132pin144pin164pin172pin176pin196pin208pin216pin256pin
Open Top0.4mm#bg#
0.5mm#bg#
0.635mm#bg#
0.65mm#bg#
0.8mm#bg#
1.0mm#bg#
Clam Shell0.4mm#bg#
0.5mm#bg#
0.635mm #bg#
0.65mm#bg#
0.8mm#bg#
1.0mm#bg#
1.27mm#bg#
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Inquiries
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Among the test sockets, the test SOP socket is required to have a particularly long life and high current capacity. When importance is placed on electrical characteristics, the short-length probe pin supports high current in the Kelvin test, and the hard Pd alloy also supports the long life of the contact. If you are looking for a stable contact and long life, press-type pin with surface pressure contact can be selected. Since the press-type Kelvin contact socket is a surface pressure welding method, it is easy to replace the pin when it is worn out, suitable solution for mass production test applications.

Enplas Semiconductor Peripheral Corporation, which operates IC Socket Solution.com, solves all the problems of SOP sockets for final testing.

POINTS

For test SOP sockets, it is necessary to select the appropriate socket specifications depending on the test method, environment, and important functions. Here, we introduce the important points in determining the specifications of the SOP socket for test.

Point1

Select the suitable pin according to the required specifications and requirements

Select a contact pin according to test specifications and requirements, such as probe pins when electrical characteristics are important, press pins when high current and high temperature are required, and press pins are always price-competitive.

Point2

If contact stability is important, adjust the pin tip shape and stroke amount

Since the crown shape at the tip of the pin has more protrusions, the more the protrusions are, the more advantageous the contact is. Also, select a pin that can adjust the stroke amount according to the device.

Point3

Select the material of the contact pin tip according to the required durability

In order to improve wear resistance, carbon coating is applied to the tip of the contact pin, or the material of the tip of the pin is changed to Pd alloy or SK material to improve durability against wear or prevent Sn from adhering to the contact pin. It leads to the improvement of life and contact stability.

Issues

Since the test SOP socket needs to show stable performance even in a harsh usage environment, it is necessary to incorporate measures to avoid troubles in advance by utilizing simulation technology. Here are some common problems you may have when using test SOP sockets and solutions to them.

Issues #1

I want to improve the durability of the socket

Durability is important because the test SOP socket is used repeatedly in many cases. The standard contact pin is made of BeCo plated with Au, but if the pin tip is used repeatedly, wear and Sn adhesion will progress, and as a result, poor contact will easily occur.

Solutions

Avoid pin wear by using Pd plating and SK material.
The carbon coating avoids deterioration of contact due to Sn plating adhesion.

Issues #2

I cannot reliably evaluate micro signal characteristics

In the electrical characteristic test, it is necessary to confirm whether it works with a minute signal in particular, but it is not possible to reliably evaluate the minute signal characteristic because the increase in resistance value cannot be suppressed with a contact pin for a normal test socket.

Solutions

Use Kelvin contact pin (probe pin option and press pin option) to minimize the signal noise.

Issues #3

PKG dimensional variation is large and contact is not stable

If the SOP package has a large variation in dimensions, positioning will become unstable and poor contact will occur easily. These package dimensional variations need to be absorbed by increasing the contact margin in the test SOP socket.

Solutions

Increase the margin with multi-point contact solution and solve contact failure!

Issues #4

I want a test socket that can handle large current

In the case of SOP packages, there are many cases where high current support is required, such as when 10 Amp or more are applied per pin, but normal contact pins do not support this. Therefore, it is necessary to select a contact pin that supports high current.

Solutions

Press-type Kelvin contact socket for high current achieves stable contact and long life.

Examples of Solutions for
SOP socket

Solutions

Lineup

PitchOperation TemperatureLifetimeLoadContact ResistanceCurrent
Press Kelvin0.4mm-65℃~150℃500,000 times45gf100mΩ8A
0.5mm
0.65mm
0.8mm
1.0mm
1.27mm
pitchOperation TemperatureLifetimeLoadInsertion Loss/ Reflection Loss
Capsule Pin0.5mm-55℃ ~ +125℃200,000 times25gf>20GHz at -1dB / >20GHz at -10dB
0.8mm250,000 times
Probe Pin0.8mm200,000 times
0.5mm200,000 times
0.4mm1,000,000 times
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Inquiries