Solutions
Examples of Semiconductor sensor Solutions
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High-Frequency Socket for System-Level Testing
Enhanced Grounding and Excellent High-Frequency Characteristics Achieved by Plating the Housing
Supports PAM4 Serdes 112Gbps Operation -
High Pin Count Solutions
Achieves stable contact performance and long life.
High current capacity is possible with integrated springs. -
QFP/SOP Open Top Socket with Ground Pins
Stable Contact Performance with Cantilever Structure (2-Point Contact)
Ground Pins for Continuity Testing and Heat Dissipation Pins for High-Heat Packages -
Low Contact Force Pin
High pin count socket can be used for existing equipment
Yield improvement in test of sensor device -
Open Top QFP/SOP pinch type socket
Pinch type contact (2-point contact) makes stable contact
Contact pin surface cleaning function prevents from accumulating debris due to the step between the bottom pin and the molded body surface. -
Socket with heat sink
Heat Sink will reduce the increase of device temperature by contacting device surface with this parts and radiating the device heat into the air.
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Individual Temparature Control System
Heater and temperature sensors can be attached to control the temperature of the device for each socket.
Achieves more accurate temperature control in comparison with general burn-in equipment (temperature setting ± 3 ° C) -
Conductivity Carbon Coating
Achieved a significant longer life of contacts by preventing solder migration
Achieved high durability with high slidablity and hardness -
ES Plating
By developing special plating (ES plating), the life of burn-in socket contacts has been extended in high temperature environments.
Maintenance costs have also been significantly reduced by reducing re-gold plating costs, etc. -
AM contact series
Low price and quick delivery for various devices by using machined Contact unit
Replacible on site by surface mounting method