Solutions
QFP/SOP Open Top Socket with Ground Pins
- Stable Contact Performance with Cantilever Structure (2-Point Contact)
- Ground Pins for Continuity Testing and Heat Dissipation Pins for High-Heat Packages
This socket is a QFP/SOP open top socket with ground pins. The main feature is that it is a 2-point open top socket with a cantilever structure that provides stable contact performance, and has ground pins. These ground pins are available for continuity testing using horseshoe pins and for heat dissipation to prevent heat buildup in packages using heat dissipation pins.
The structure is designed such that the ground pins move down in conjunction with the cover operation, and after the package is seated, the contact pins contact the leads, and then the ground pins contact the pads on the back of the package. This prevents deformation of the package leads.
This 2-point contact and ground pin configuration provides stable contact performance and enables continuity testing and heat dissipation for high-heat packages with heat dissipation pins.
Examples of IC Socket Solutions Solution Examples
- All Solutions
- Choose by application
- Choose by device
- Choose by PKG
- Choose by issue
Examples of Analog Solutions
-
QFP/SOP Open Top Socket with Ground Pins
Stable Contact Performance with Cantilever Structure (2-Point Contact)
Ground Pins for Continuity Testing and Heat Dissipation Pins for High-Heat Packages -
Non-magnetic Socket
Non-magnetic socket will be required for sensor application
Corrosion resistance with non-magnetic performance -
Open top BGA two contact socket
Stable contact performance due to (two-point contact) structure
Double door structure makes it easy to insert PKG -
Open Top QFP/SOP pinch type socket
Pinch type contact (2-point contact) makes stable contact
Contact pin surface cleaning function prevents from accumulating debris due to the step between the bottom pin and the molded body surface. -
LCF series (general-purpose molded frame)
Low price and quick delivery for various devices up to 100mmx100mm
Replacible on site by surface mounting method -
Socket with heat sink
Heat Sink will reduce the increase of device temperature by contacting device surface with this parts and radiating the device heat into the air.
-
Conductivity Carbon Coating
Achieved a significant longer life of contacts by preventing solder migration
Achieved high durability with high slidablity and hardness -
Super Shrink Socket
Increase of BIB density (1.8 times better density rate per 1 BIB)
In the condition of same socket qty, the reduction of BIB qty (45% reduction) -
ES Plating
By developing special plating (ES plating), the life of burn-in socket contacts has been extended in high temperature environments.
Maintenance costs have also been significantly reduced by reducing re-gold plating costs, etc. -
AM contact series
Low price and quick delivery for various devices by using machined Contact unit
Replacible on site by surface mounting method