Using burn-in and test sockets to address issues in product assessment,
electrical properties, and reliability testing of various devices.

Terminology

PGA

PGA, or Pin Grid Array, is a type of package where pins are arranged in a grid or staggered pattern on the bottom surface of the package to serve as electrodes, instead of the balls used in BGA (Ball Grid Array) packages. PGA allows for a high number of pins to be accommodated, making it a popular choice for multi-pin packages. Before the development of surface-mountable BGAs, PGAs were the mainstream solution for packages with a large number of pins.