Terminology
BGA
BGA, or Ball Grid Array, is a type of surface-mount package characterized by the use of spherical solder balls (the “balls” in BGA) arranged in a grid pattern on the underside of the package, replacing traditional leads. This package involves mounting an LSI (Large Scale Integration) chip on the surface of a printed circuit board and then sealing it with mold resin or potting. BGAs are primarily used for multi-pin LSI packages, typically with more than 200 terminals.
The advantages of BGA include the ability to accommodate a large number of contacts relative to the size of the package body, the elimination of risks associated with lead deformation, and lower lead inductance compared to QFP (Quad Flat Package). These features make BGAs suitable for packaging high-speed logic LSIs and high-speed SRAMs (Static Random Access Memory).