Temperature cycling test is one type of reliability test for electronic components. It simulates severe real-world operating environments by applying rapid and extreme temperature changes, causing expansion and contraction stress. This process is repeated to detect fatigue-related defects such as peeling, cracking, or failure, ultimately determining the product’s lifespan.
There are standards like JIS C 60068-2-14 for repetitive temperature changes and ISO 16750-4, which is used for environmental testing of automotive electronics.
Characteristics of Temperature Cycling Test
1. Testing under high and low temperatures
Typically, temperature cycling tests subject products to a temperature range from about -40°C to +125°C. This simulates the stress that products would endure in real-world environments.
2. Testing with consistent cycles
One temperature rise and fall cycle is defined as one complete test cycle. By repeating this process dozens or hundreds of times, it is possible to verify whether the product can operate normally under various environmental conditions in a short period.
3. Evaluation of thermal stress
Materials used in electronic components like metals, silicon, and resin expand and contract with temperature changes. The amount of expansion varies depending on the material, and the difference in expansion between bonded materials generates internal thermal stress. Accumulated stress can lead to defects such as cracking or peeling, which are evaluated through the temperature cycling test.
4. Specialized test equipment
Temperature cycling tests are conducted using rapid temperature change chambers and constant temperature/humidity test equipment, which allow precise temperature control inside the chamber. These devices can simulate stress loads accurately, whether through rapid temperature changes or milder settings closer to typical environmental conditions.
Difference between Temperature Cycling Test and Thermal Shock Test
There is often confusion between temperature cycling tests and thermal shock tests. Both involve applying high and low-temperature extremes to verify the product’s durability against temperature changes, but the main difference lies in the speed of temperature change.
In the temperature cycling test, the temperature change is relatively gradual, with the set temperature range (about -40°C to +125°C) changing at a constant rate. The temperature range and rate of change can vary depending on the environment or component being tested. For example, electronic components are tested within a -40°C to +125°C range at a rate of 5°C/min, while automotive parts, expected to endure harsher conditions, are tested in a -40°C to 85°C or 105°C range at a faster rate of 10°C/min.
In contrast, the thermal shock test subjects the target object to even more rapid temperature changes, transitioning between extremes (approximately -55°C to +150°C) within a few seconds to several tens of seconds. This test is useful for evaluating resistance to instantaneous defects such as cracking, separation, and deformation caused by rapid temperature changes.
Conclusion
The temperature cycling test plays a vital role in the reliability testing of electronic components and devices. At Enplas, we offer advanced solutions with IC sockets that help evaluate the electrical characteristics and reliability of ICs. If you have any concerns regarding IC sockets, feel free to contact us!