Terminology
LGA
LGA, or Land Grid Array, is a type of package where flat pads, known as “lands,” are arranged in a grid or staggered pattern to serve as electrodes, replacing the balls found in BGA (Ball Grid Array) packages. A key characteristic of LGA is that it allows for socket mounting, which is not always possible with BGA packages. Additionally, LGA packages can be designed with a lower profile, reducing the overall height of the mounted component. This feature makes LGAs particularly advantageous in applications where space is a constraint.