Terminology
QFN
QFN, or Quad Flat No-lead, refers to a type of surface-mount packaging without leads, where electrode pads are placed on all four sides of a ceramic substrate. The same shape made with ceramic material is known as LCC (Leadless Chip Carrier). Pin pitches for QFN packages vary and include sizes like 1.27mm, as well as smaller dimensions such as 0.65mm and 0.5mm.