IC Socket Technical Information

What is a burn-in test ?

The burn-in test is an accelerated test used to identify initial defects in semiconductors and devices. Typically, this stress test involves powering the semiconductor for several hours in a 125°C environment. By intentionally inducing initial defects in this way, the failure rate in the market is reduced, as defective products are eliminated before shipping.

Burn-in tests are commonly conducted on automotive products that require particularly high reliability among semiconductor devices. However, to improve the yield rate even for devices with poor manufacturing yields, such as memory and high-power systems, a burn-in test is also performed. There are two typef burn-in tests: (1) mass production burn-in and (2) reliability evaluation.

As various devices, including automobiles, become more digitalized, the need to enhance the reliability of semiconductors and devices and minimize the release of defective products into the market grows increasingly crucial. Thus, the role of the burn-in test is becoming more important.

 

What is a burn-in sockets?

Burn-in sockets are package-specific sockets used to conduct burn-in testing of semiconductors and devices in high-temperature environments. Although burn-in tests are usually performed at 125°C, devices used in automotive applications such as “running,” “turning,” and “stopping”—particularly those around the engine—are tested at even higher temperatures.

Burn-in sockets are required to operate stably under these harsh conditions, and high performance is essential. In response to this trend, the recent development of semiconductors and devices is accelerating towards a wide variety of products in small quantities, increasing the demand for burn-in sockets.

 

Applications that require burn-in testing

As mentioned earlier, the purpose of the burn-in test is twofold:

(1) By conducting an accelerated test on semiconductors/devices, we intentionally identify defective products to ensure the reliability of the products that are shipped.

(2) We test semiconductors/devices with low yields.

There are two primary applications that require burn-in testing. For automotive semiconductors, the main goal is to ensure reliability, while for memory and high-power devices, the focus is primarily on improving yield.

 

Recent Burn-in Test Trends

As the digitization of everyday devices continues to expand, the number and types of semiconductors and devices will only grow. With this trend, electronic devices are increasingly required to have higher reliability and lower defect rates. Among these, in-vehicle systems like ADAS (Advanced Driver Assistance Systems) and CASE (connected, autonomous driving, sharing, and electrification) are experiencing rapid growth.

In these areas, measures to drastically reduce the defect rate are essential. To meet the demands and challenges of this market, burn-in sockets must also be designed to withstand higher temperatures, and to be more reliable and reproducible.

 

What is required of burn-in sockets

As the market changes and the needs for burn-in testing increase, there are three major requirements for burn-in sockets.

Being able to perform reliable screening

The most crucial aspect of burn-in sockets is their ability to perform reliable screening and to measure consistently even after hours of repeated use at high temperatures. In particular, they must have high and stable contact properties in their contact pins.

Being able to test under certain conditions even in a high

Burn-in tests conducted in high-temperature environments involve both self-heating of semiconductors and devices, as well as ambient temperature. Therefore, burn-in sockets must also be capable of functioning reliably under these harsh conditions.

High workability

Mass-produced or high-volume devices often require repeated insertion and removal using a single burn-in socket. Consequently, the burn-in test must be compatible with automated equipment. In addition to automated equipment, manual sockets can also be used for tasks such as reliability evaluations involving smaller quantities, but high workability remains crucial.